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Aluminum oxide thermal conductive powder

  • Product Name: Aluminum Oxide Thermal Conductive Powder
  • Intended Use: Enhancing thermal conductivity in composites, coatings, and electronic packaging
  • Chemical Formula: Al2O3
  • Purity: Typically >99.5%
  • Particle Size: Available in various sizes, commonly in the range of 0.5-10 µm for optimal dispersion and performance
  • Appearance: White to off-white powder
  • Density: Approximately 3.97 g/cm³, contributing to the stability of the composite or coating.
  • Melting Point: Approximately 2,072°C, ensuring thermal stability in high-temperature applications.
  • Average Particle Size : 1-5um,
  • Al2O3 Content %: 99.5
  • Pack Sizes :  10kg, 100kg, 500kg, 1000kg

Product Overview

Hiyka's Aluminum Oxide Thermal Conductive Powder is a high-purity, finely milled Al2O3 material engineered to improve thermal management solutions across a wide range of industries. With its outstanding thermal conductivity and excellent electrical insulation properties, this powder is ideal for use in electronic packaging, heat sinks, thermal interface materials, and other applications requiring efficient heat dissipation without electrical conductivity. Our aluminum oxide powder is designed to meet the demanding specifications of advanced engineering, ensuring optimal performance and reliability in your thermal management systems.

Key factor

  • High Thermal Conductivity: Facilitates efficient heat transfer and dissipation, crucial for maintaining optimal operating temperatures in electronic devices and systems.
  • Electrical Insulation: Offers excellent electrical insulation properties, making it suitable for applications requiring a combination of thermal conductivity and electrical isolation.
  • Chemical Stability: Exhibits superior resistance to chemical attack, ensuring long-term stability and performance in harsh environments.
  • Versatile Application: Easily integrated into composites, coatings, and adhesives for enhanced thermal management capabilities across various platforms.
  • Eco-friendly: Contributes to the sustainability of products by improving energy efficiency and reducing thermal-related failures.

Applications

  • Electronic Packaging: Enhances the thermal management of integrated circuits, LEDs, and other electronic components, preventing overheating and ensuring longevity.
  • Heat Sinks and Spreaders: Utilized in the manufacture of heat sinks and thermal spreaders for computers, telecommunications equipment, and power electronics.
  • Thermal Interface Materials (TIMs): Improves the performance of TIMs used between processor chips and heat sinks to enhance heat transfer.
  • Insulating Coatings: Applied in the formulation of insulating coatings that require thermal conductivity without electrical conductivity for electrical and electronic applications.
  • High-performance Composites: Incorporated into polymer, ceramic, and metal matrix composites for improved thermal management in automotive, aerospace, and industrial machinery.

Advantages

  • Enhanced Thermal Efficiency: Provides effective heat management solutions, leading to improved performance and reliability of electronic devices and systems.
  • Reliability and Durability: Offers long-term chemical and thermal stability, ensuring the durability of thermal management solutions.
  • Design Flexibility: Adaptable to various formulations and applications, allowing for innovative thermal management designs and strategies.
  • Cost-Effective: Delivers a high-performance, economical solution for advanced thermal management challenges, reducing the need for additional cooling systems.
  • Sustainable Material: Supports the development of energy-efficient and durable products, contributing to environmental sustainability.

References 

  • Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

    S Choi, J Kim - Composites Part B: Engineering, 2013 - Elsevier
  • Properties and effect of preparation method of thermally conductive polypropylene/aluminum oxide composite

    B Li, R Li, Y Xie - Journal of materials science, 2017 - Springer
  • Thermal conductivity of tunable lamellar aluminum oxide/polymethyl methacrylate hybrid composites

    R Chen, MB Johnson, KP Plucknett… - Journal of Materials …, 2012 - Springer
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