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Graphene electroconductive adhesive

  • component: silver powder, graphene, resin.
  • graphene content: 3% ,
  • Viscosity: 13000
  • thixotropic index: 4.5 ,
  • particle size: <10 μm
  • Density: 3.8 g/cm3
  • shelf life, (-5℃): 6 month
  • solidify condition, (150℃): 60 min
  • shear strength, (25℃): 21 Kg/die
  • electrical resistivity: 0.0002 Ω*cm
  • thermal conductivity, (120℃): 9.5 W/mK
  • glass state temperature: 110 ℃
  • thermal expansivity: 55 ppm/℃
  • temperature of thermal decompositio: >300 ℃
  • appearance: silvery paste

Product Overview

Our Graphene Electroconductive Adhesive is a breakthrough in the field of electronic assembly and repair, blending the unparalleled conductivity of graphene with robust adhesive capabilities. Designed to facilitate strong, conductive bonds between electronic components, this innovative adhesive material is setting new standards for efficiency, reliability, and performance in electrical connections.

Key factor

  • Superior Electrical Conductivity: Harnesses the high conductivity of graphene to ensure optimal electrical performance of bonded components.
  • Strong Adhesive Bond: Offers excellent adhesion to a wide variety of substrates, including metals, plastics, and ceramics, ensuring a durable bond.
  • Easy Application: Can be applied using standard adhesive application methods, allowing for straightforward integration into manufacturing and repair processes.
  • Rapid Curing: Designed for quick curing, minimizing downtime in assembly lines and repair operations.
  • High Reliability: Provides a reliable conductive bond that withstands thermal cycling, vibration, and environmental stress, ensuring long-term performance.

Applications

  • Enhanced Device Performance: Ensures uninterrupted electrical conductivity, crucial for the efficient operation of electronic devices.
  • Versatile Use: Ideal for a range of applications, from PCB assembly and component repair to creating conductive paths in wearable electronics.
  • Reduced Processing Time: Streamlines manufacturing and repair processes with its ease of application and rapid curing time, boosting productivity.
  • Improved Durability: The durability of the adhesive bond helps extend the lifespan of electronic components and devices, contributing to sustainability.

Advantages

  • Electronics Manufacturing: Crucial for assembling and bonding electronic components, including chips, connectors, and displays, in smartphones, tablets, and other consumer electronics.
  • Wearable Technology: Enables the integration of conductive tracks and components in flexible substrates, essential for the development of smart textiles and wearable devices.
  • Automotive Electronics: Used in assembling and repairing electronic systems within vehicles, including sensors, control units, and infotainment systems.
  • Aerospace and Defense: Provides robust, conductive bonding solutions for the rigorous demands of aerospace and military electronics.

Why HIYKA

The Graphene Electroconductive Adhesive is a game-changing solution that combines the conductive power of graphene with advanced adhesive technology, offering unparalleled performance in electronic assembly and repair. By adopting this graphene-based adhesive, industries can achieve more efficient, reliable, and durable electrical connections, driving innovation and excellence in electronic manufacturing and beyond. Embrace the future of electrical connections with our Graphene Electroconductive Adhesive, where cutting-edge conductivity meets versatile bonding strength.

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    Disclaimer

    The product image(s) shown is a reference for the actual product. While every effort has been made to maintain complete accuracy and up to date product information, it is important to go through details such as product labels, manufacturing details, batch, warnings, and directions before using a packaged product.

    For additional information, please refer to the contact details mentioned on the label. 

    For bulk orders contact us on [email protected]

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