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Copper/ Tin – Alloy Nanopowder

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  • Copper-Tin alloy (90:10)
  • Purity: > 97.0 %
  • Particle shape: spherical
  • Average particle size: 70 – 80 nm.
  • Particle size full range: 5 – 250 nm
  • Specific surface area: > 10 m 2/g
  • Bulk density: > 0.8 g/cm3
  • Controlled admixtures, %: Fe < 0.1; W < 0.2
  • Pack Sizes Available : 10 gm, 50 gm, 100gm ( Research Purposes )

Product Overview

Copper/Tin alloy nanopowder is a high-performance nanomaterial composed of copper and tin particles at the nanoscale. This alloy nanopowder is renowned for its excellent electrical and thermal conductivity, mechanical strength, and corrosion resistance. It is widely used in various advanced applications, including electronics, coatings, and additive manufacturing.

Key factor

  • Nanoparticle Composition: Composed of copper and tin particles at the nanoscale, providing unique properties compared to bulk materials.
  • High Purity: Typically available in high purity, ensuring consistent and reliable performance.
  • Excellent Conductivity: Superior electrical and thermal conductivity due to the metallic nature of the alloy.
  • Mechanical Strength: Enhanced mechanical properties, including hardness and durability.
  • Corrosion Resistance: Improved resistance to oxidation and corrosion, extending the lifespan of the material in various environments.

Applications

  • Electronics: Used in conductive inks, pastes, and coatings for printed electronics, circuit boards, and other electronic components.
  • Additive Manufacturing: Utilized in 3D printing and additive manufacturing processes to create complex parts with enhanced properties.
  • Coatings: Applied as a coating material for improved electrical conductivity, thermal management, and corrosion resistance.
  • Soldering: Employed in solder materials for better joint strength and reliability in electronic assemblies.
  • Catalysts: Acts as a catalyst in chemical reactions, benefiting from the high surface area and reactivity of the nanoparticles.
  • Energy Storage: Used in battery and supercapacitor electrodes to enhance performance and efficiency.

Advantages

  • Enhanced Properties: Combines the advantageous properties of both copper and tin at the nanoscale.
  • Versatility: Suitable for a wide range of applications, including electronics, coatings, and additive manufacturing.
  • Improved Performance: Offers superior electrical and thermal conductivity, mechanical strength, and corrosion resistance compared to conventional materials.
  • High Purity: Ensures minimal impurities, leading to more consistent and reliable performance.
  • Scalability: Can be produced in various quantities to meet the needs of different industrial applications.

Why HIYKA

Offers excellent electrical and thermal conductivity for high-performance applications. Provides superior mechanical strength and corrosion resistance. Ensures consistent and reliable performance with minimal impurities. Suitable for a wide range of applications in electronics, coatings, additive manufacturing, and more. Available in various quantities to meet industrial needs.

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    Disclaimer

    The product image(s) shown is a reference for the actual product. While every effort has been made to maintain complete accuracy and up to date product information, it is important to go through details such as product labels, manufacturing details, batch, warnings, and directions before using a packaged product.

    For additional information, please refer to the Contact us on- +91-120-4781-212/3

    For bulk orders Contact us on : [email protected]

    • We offer different prices for different pack sizes available.

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