Graphene electroconductive adhesive
Graphene electroconductive adhesive
component: silver powder, graphene, resin.
graphene content: 3% , Viscosity: 13000
thixotropic index: 4.5 , particle size: <10 μm
Density: 3.8 g/cm3
shelf life, (-5℃): 6 month
solidify condition, (150℃): 60 min
shear strength, (25℃): 21 Kg/die
electrical resistivity: 0.0002 Ω*cm
thermal conductivity, (120℃): 9.5 W/mK
glass state temperature: 110 ℃
thermal expansivity: 55 ppm/℃
temperature of thermal decompositio: >300 ℃
appearance: silvery paste
Application: used for FPC industry(Flexible Printed Circuit), good adhesion to PET, PI.
Feature: Low electrical resistivity, stable quality good bending resistance, anti-oxidation, good thixotropy resistance to heat and humidity, comply with RoHS – Restriction of Hazardous Substances, low volatility, long service cycle.
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