Product Overview
Hiyka's Copper Nanopowder, Dry (20nm) produced by Plasma technology, is a state-of-the-art material designed for optimal performance in a wide array of high-tech applications. This ultra-fine copper powder is synthesized using advanced plasma chemical processes, ensuring a high degree of purity and uniform nanoparticle size distribution. The 20nm size optimizes surface area to volume ratio, enhancing the powder's electrical and thermal conductivity properties, making it ideal for use in electronics, catalysis, and advanced material composites.
Key factor
- Advanced Plasma Technology: Utilizes a cutting-edge plasma synthesis method that produces nanoparticles with exceptional purity and structural integrity.
- Ultra-Fine Particle Size: At 20 nm, the powder offers an extensive surface area, critical for applications requiring high reactivity and efficiency.
- High Purity: The production process significantly reduces impurities that can detract from electrical and thermal performance.
- Excellent Conductivity: Copper’s natural electrical conductivity is enhanced at the nanoscale, making it perfect for electronic applications.
- Versatility: Suitable for a broad range of applications due to its properties and nano-scale advantages.
Applications
- Electronics: Used in the manufacturing of conductive inks and pastes, essential for printing electronic circuits and fabricating semiconductor devices.
- Catalysis: Acts as a catalyst in chemical reactions, especially where high surface reactivity is required to improve reaction rates.
- Energy Storage: Enhances the conductivity and performance of electrode materials in batteries and supercapacitors.
- Additive Manufacturing: Ideal for 3D printing applications where conductive materials are needed.
- Heat Dissipation Materials: Utilized in thermal interface materials for its excellent thermal conductivity, aiding in heat management of electronic devices.
Advantages
- Enhanced Electrical Properties: Provides superior electrical conductivity, crucial for reducing energy losses in electronic applications.
- Improved Thermal Management: Offers outstanding thermal properties for effective heat dissipation in high-performance electronics.
- High Surface Activity: Increased surface area enhances catalytic and chemical reactivity, beneficial for speeding up industrial chemical processes.
- Environmental Resistance: Maintains stability and performance under various environmental conditions, ensuring long-term durability.
- Cost-Effective: Efficient usage and longevity reduce the overall cost of materials and processes.
Why HIYKA
Hiyka employs Plasma technology, a leading-edge method in nanoparticle synthesis that ensures exceptionally high purity and uniform particle size. This technology enhances the physical and chemical properties of copper nanoparticles, making them highly effective for a variety of applications. Understanding the diverse needs of its customers, Hiyka offers the ability to customize nanopowder specifications including particle size, coating, and dispersion characteristics. This flexibility allows for the optimization of the copper nanoparticles to meet specific requirements of different industrial applications.
5g, 25g, 50g 100g
